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Sector
Semiconductors
China Wafer Level CSP Co., Ltd., together with its subsidiaries, creates, develops, manufactures, and sells semiconductor, interconnect, and imaging technologies in China and internationally. The company offers image sensor, biometric identification, and ambient light sensor chips; medical electronic devices; and manufacturing services of TSV and 3DIC technology. It also provides design, test, and logistics solutions, including design chain management; design for manufacturing; design for cost; full design and verification of WL, lead frame, laminate, etc.; electrical, thermal, and mechanical characterization; and quick turn prototype services, as well as packaging and testing services. In addition, the company offers assembly services, such as turnkey solutions for TSV, wire bond, and flip chip; high-volume manufacturing; wafer finishing and 2/3D assembly; wafer to wafer and die to wafer bonding; micro-joining; integrated and SMT passives, as well as FA and reliability testing services comprising package and board level, bump reliability, underfill/EMC adhesion, drop and bend tests, solder joint reliability prediction, materials lab, and failure analysis. Further, it engages in research and development; patent management; field application promotion; investment management; and technology development activities. It exports its products. The company serves mobile handset manufacturers and semiconductor chip design houses. China Wafer Level CSP Co., Ltd. was founded in 2005 and is headquartered in Suzhou, China.
www.wlcsp.comNo one on the platform currently holds 603005.SS.
No tracked institution reports a position in 603005.SS as of their last filing.
No one on the platform has traded 603005.SS yet.
Consensus-seeded revenue, margins, and exit multiples. This is a scenario tool, not investment advice.
Consensus does not cover every selected forecast year. Later assumptions are extrapolated from available analyst estimates.
| Metric | Historical average | My assumptions | ||||
|---|---|---|---|---|---|---|
| 1 year | 5 years | 10 years | Low | Mid | High | |
| ROIC % | 12.4% | 15.8% | 13.9% | — | — | — |
| Rev. Growth % | 30.4% | 6.0% | ||||
| Profit Margin % | 25.1% | 25.1% | 21.7% | |||
| Free Cash Flow Margin % | -4.6% | 13.3% | 16.8% | |||
| Exit P/E | — | — | — | |||
| Exit P/FCF | — | — | — | |||
| Desired Annual Return % | — | — | — | |||
At today's price, your expected annual return is — on the P/E track.
At today's price, your expected annual return is — on the P/E track.
At today's price, your expected annual return is — on the P/E track.
No recent Form 4 filings on EDGAR — either no insider transactions reported recently or this isn't a SEC-registered issuer.
| Year | Est. revenue | Growth | Est. EPS | EPS range | Fwd P/E | # Analysts |
|---|---|---|---|---|---|---|
| 2026 | $1.9B | +26.3% | $0.75 | $0.75–$0.75 | — | 1 |
| 2027 | $1.7B | -12.1% | $0.84 | $0.84–$0.84 | — | 1 |
Forward consensus · growth is YoY vs the prior fiscal-year estimate · Fwd P/E at the current price · source: Financial Modeling Prep
| Symbol | Price | Today | Mkt cap | P/E |
|---|---|---|---|---|
| 603005.SSChina Wafer Level CSP Co., Ltd. | $29.03 | +0.83% | $18.9B | — |
| 002987.SZNorthking Information Technology Co., Ltd. | $10.81 | -1.10% | $11.2B | — |
| 300236.SZShanghai Sinyang Semiconductor Materials Co., Ltd. | $84.93 | +1.77% | $26.6B | — |
| 300456.SZSai MicroElectronics Inc. | $33.90 | -1.40% | $24.8B | — |
| 300672.SZHunan Goke Microelectronics Co.,Ltd. | $164.10 | +0.91% | $35.6B | — |
| 301536.SZSigmaStar Technology Ltd | $109.28 |
Source: Financial Modeling Prep · peers by sector/industry
| -0.50% |
| $29.8B |
| — |
| 600206.SSGrinm Advanced Materials Co., Ltd. | $46.94 | -0.66% | $39.7B | — |