5297.TWO

3s Silicon Tech., Inc., established in 1998 and headquartered in Hsinchu, Taiwan, specializes in providing die bonding solutions for discrete power devices to customers both locally and globally. Their comprehensive product line includes advanced clip die bonders for power devices, which incorporate functionalities such as clip attachment and precise pick-and-place capabilities. The company also offers a diverse range of snap ovens, encompassing standard models, units with vacuum reflow processes, formic acid reflow ovens, and flux eutectic reflow ovens, alongside complete power module assembly automation solutions. Additionally, 3s Silicon Tech. engineers custom automation equipment tailored for both power device and power discrete assembly. Clients can also utilize their open lab platform for thorough product and fabrication process verification.